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Etching Equipment Product List and Ranking from 35 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

Etching Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. サムコ Kyoto//Industrial Machinery
  2. 伯東 本社 Tokyo//Electronic Components and Semiconductors
  3. 神港精機 東京支店 Tokyo//Industrial Machinery
  4. 4 二宮システム Osaka//others
  5. 5 NSC エンジニアリング本部 Osaka//Industrial Machinery
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Etching Equipment Product ranking

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. Ion Beam Milling and Etching Equipment - Hakuto/Ns 伯東 本社
  2. Dry etching device RIE-10NR (parallel plate type RIE device) サムコ
  3. Plasma etching device "EXAM" sample testing now accepting applications. 神港精機 東京支店
  4. Glass Etching Equipment [LCD Glass Substrate] | NSCEng NSC エンジニアリング本部
  5. 4 Eminent Series Third Generation Etching Device "Eminent 2" 東京化工機 本社・長野工場

Etching Equipment Product List

1～30 item / All 82 items

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Small Etching Device 'YCE-85V'

Small Etching Device 'YCE-85V'

A small etching machine equipped with pressure gauges on both the top and bottom of the spray!

The "YCE-85V" is a compact etching machine equipped with a side tank for easy liquid input. The tank has a window for checking the liquid level. It is mainly suitable for research and development applications such as ferric chloride liquid etching and cupric chloride liquid etching. 【Features of the 85V Series】 ■ Horizontal oscillating nozzle pipe ■ Side tank for easy liquid input ■ Window for checking the liquid level in the tank ■ Pressure gauges for both spray up and down ■ Further improved usability of the 85 III series *For more details, please download the PDF or feel free to contact us.

  • Etching Equipment
  • Etching Equipment

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Etching device "YCE-500WA"

Etching device "YCE-500WA"

Our unique nozzle arrangement and oscillation mechanism enable high-precision etching without unevenness!

The "YCE-500WA" is an etching machine that allows for high-precision etching with the push of a button. The main body and other parts are made from completely corrosion-resistant materials that can withstand both acid and alkaline etchants. Additionally, it features large inspection windows and sturdy pressure valves to ensure safety during operation. 【Features】 ■ Fully automatic processing from preparation to etching and rinsing with the push of a button ■ With the all-day timer (optional), etching can be started immediately every morning ■ The use of a digital temperature controller and liquid circulation pump ensures uniform and constant liquid temperature control ■ Conveyor speed is accurately controlled with digital display ■ Built-in safety protection devices for liquid shortage, water shortage, and abnormal overheating *For more details, please download the PDF or feel free to contact us.

  • Etching Equipment
  • Etching Equipment

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Research and development etching device SPE40

Research and development etching device SPE40

Research and development etching device SPE40

【Process】Input → Etching → Liquid Drain → Circulation Water Wash → Direct Water Wash → Squeeze → Extraction 【Substrate Size】Max. W400×L500mm Thickness 0.4〜2.0mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1300×L1590×H1215mm - Space-saving for research use - Ideal for material development and testing - Capable of etching PCBs and LCDs

  • Other surface treatment equipment
  • Etching Equipment
  • Other laboratory equipment and containers
  • Etching Equipment

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Small Etching Device for Research and Development HPE40

Small Etching Device for Research and Development HPE40

Compact etching machine that is suitable for narrow spaces, allows for customizable settings based on usage, and achieves short delivery times.

【Process】Input → Etching → Liquid Drain → Rinse 1 → Rinse 2 → Squeeze → Extraction 【Board Size】Max. W400 × L500 mm Thickness 0.4 to 2.0 mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1420 × L1950 × H1645 mm - Space-saving for research use - Ideal for material development and testing - Capable of etching PCB and LCD

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Ninomiya System ITO Etching Equipment

Ninomiya System ITO Etching Equipment

Ninomiya System ITO Etching Equipment

We contribute to enhancing our customers' added value by utilizing advanced fine processing technology for development and etching, as well as sophisticated thin plate transportation technology.

  • Etching Equipment
  • Etching Equipment

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Copper surface roughening treatment device - Micro-etching device

Copper surface roughening treatment device - Micro-etching device

It is possible to stably transport workpieces with a thickness of 50 μm, and it is also compatible with FPC transport.

The copper surface roughening treatment device, micro-etching device, is a surface treatment device capable of stably transporting workpieces with a thickness of 50 μm. The fine specification nozzle pattern and oscillation mechanism enable uniform surface accuracy. The upper etching is individually pressure-controlled for even higher precision. For more details, please contact us or refer to the catalog.

  • Other surface treatment equipment
  • Etching Equipment
  • Etching Equipment

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Tabletop Plasma Etching Device 'TP-50B'

Tabletop Plasma Etching Device 'TP-50B'

Tabletop plasma etching device capable of localized processing with unique spot plasma technology.

The "TP-50B" is a 50W model that does not require installation permission applications under the Radio Law, and it is an easy-to-operate tabletop plasma etching device that allows for casual plasma processing. With its unique spot plasma technology, it enables localized processing and can handle a wide range of plasma processing from pre-treatment of semiconductor failure analysis samples (exposing wiring) to various plasma applications. Additionally, its compact size makes it suitable for use in research labs with limited space. 【Features】 ■ Compact tabletop size ■ Capable of localized plasma processing (Φ0.5mm and above) ■ Achieves low residue and high-speed processing (10μm/min) ■ Low-output RF power supply (maximum output of less than 50W) ■ Allows for extensive processing by moving the sample on the stage *For more details, please download the PDF or feel free to contact us.

  • Plasma surface treatment equipment
  • Etching Equipment

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ICP metal etching equipment

ICP metal etching equipment

Supports etching of fine patterns of metal films such as Al and Cr! Demo machines available! Facility tours and sample testing are currently being conducted.

The "ICP Metal Etching Device" is a high-density plasma etching device compatible with metal films, designed for advanced thin film processes. It actively supports not only general devices such as semiconductors and MEMS but also special processes like surface treatment for exposure masks and metal substrates. Thanks to its unique chamber structure, it achieves metal etching with low particle contamination at the nm level, characterized by high yield and operational efficiency. 【Features】 ■ Precision etching of metal films at the nm level ■ Low particle process through a unique mechanism ■ Process compatibility for a wide range of applications, including metal films and compound semiconductor substrates ■ High reliability of hardware leveraging the basic configuration of "SERIO" for nanoimprint molds ■ Active support for not only wafers but also special materials and shaped substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment
  • Plasma surface treatment equipment
  • Etching Equipment

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ICP plasma etching device "SERIO"

ICP plasma etching device "SERIO"

Achieve smooth etching surfaces and high machining precision! We support sample testing!

"SERIO" is a high-density plasma etching device that accommodates a wide range of applications, including deep silicon etching, vertical processing of quartz, and organic film etching. Equipped with a proven ICP plasma electrode, it achieves smooth etching surfaces and high processing precision. It enables smooth etching without scalloping, making it suitable for creating nanoimprint molds. It possesses many process capabilities required for nanoimprint molds, such as smooth etching sidewalls, verticality of the processing surface, and control of opening angles. 【Features】 ■ Smooth etching sidewalls without scalloping ■ High verticality during deep silicon etching (90°±2°) ■ Controllability of etching taper angles ■ Support for high aspect ratio etching ■ Permanent demonstration unit available ■ Sample testing available *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment
  • Etching Equipment

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Plasma etching device "EXAM" sample testing now accepting applications.

Plasma etching device "EXAM" sample testing now accepting applications.

A compact batch-type plasma etching device that supports sub-micron etching and features process support through sample testing.

Supports etching of submicron Si oxide films in batch type. Compatible not only with SiN and Si-based thin films but also with high melting point metals and difficult-to-etch materials. Ideal for processing niche devices such as vertical etching of quartz and fine processing of thick photoresist. Actively supports a wide range of applications from ashing to cleaning through a multi-step process enabled by plasma mode switching.

  • Etching Equipment
  • Other physicochemical equipment
  • Plasma Generator
  • Etching Equipment

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Dry etching device RIE-10NR (parallel plate type RIE device)

Dry etching device RIE-10NR (parallel plate type RIE device)

A versatile dry etching device boasting hundreds of successful installations.

● High selection ratio and high-precision etching are possible. ● Automatic operation and process parameter storage are possible with PLC control. ● Samples up to φ8 inches can be accommodated. ● High-speed exhaust etching is possible. ● Compact design.

  • Etching Equipment
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Trench processing of GaN for power devices

Trench processing of GaN for power devices

We will introduce the trench processing of GaN based on our past processing achievements.

Our company has a proven track record as a semiconductor manufacturing equipment manufacturer, providing ICP etching equipment, CVD equipment, and process technology for the production of GaN-based light-emitting devices. We also offer equipment capable of trench processing and mesa processing for 4H-SiC power devices. This document introduces the trench processing of GaN based on our past processing achievements. [Contents] ■ Introduction ■ Schematic diagram of trench MOSFET ■ Trench processing of GaN ■ Etching results ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

  • CVD Equipment
  • Etching Equipment

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Si Deep Excavation Device 'RIE-800BCT'

Si Deep Excavation Device 'RIE-800BCT'

Production equipment compatible with 2 reaction chambers and 2 cassettes! Capable of deep Si etching from nano to micro levels.

The RIE-800BCT is a production silicon deep etching device that employs inductively coupled plasma in its discharge method. It enables high-aspect-ratio processing of over 50 and low scallop processing while maintaining a high etching rate and selectivity with resist. Additionally, by rapidly switching gases, it can reduce scallops while maintaining the etching rate. 【Features】 - Capable of deep silicon etching from nano to micro levels - Supports wafers up to 8 inches in diameter - High-aspect-ratio processing of over 50 - Low scallop processing - Extensive process library *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
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Automatic developing/etching equipment

Automatic developing/etching equipment

Easy-to-operate CtoC robot transportable development/etching equipment. Both developer and etcher can be manufactured according to application.

We can customize it according to your needs and budget, so please feel free to contact us. Additionally, we also have general-purpose machines that do not have a transport mechanism.

  • Resist Device
  • Etching Equipment
  • Other semiconductor manufacturing equipment
  • Etching Equipment

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Etching device, rapid etching device

Etching device, rapid etching device

Demo units available for loan! Wafers are loaded and processed in a dedicated barrel.

This machine is a device that performs high-speed wafer etching processing. The wafers are loaded into a dedicated barrel for processing. For more details, please contact us.

  • Etching Equipment
  • Etching Equipment

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Custom-made production achievements: Dry etching equipment

Custom-made production achievements: Dry etching equipment

We have a track record of devices such as "XeF2 etching equipment" and "batch-type ashing equipment."

We would like to introduce the custom manufacturing achievements of Japan Create Co., Ltd. regarding "Dry Etching Equipment." We have a track record of "ICP Etching Equipment for Research and Development," "ICP Plasma Etching Equipment," "XeF2 Etching Equipment," and "Batch-type Ashing Equipment." Sample processing is being conducted using demo units. Please feel free to contact us when needed. 【Manufacturing Achievements】 ■ ICP Etching Equipment for Research and Development ■ ICP Plasma Etching Equipment ■ XeF2 Etching Equipment ■ Batch-type Ashing Equipment *For more details, please refer to the PDF materials or feel free to contact us.

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  • Etching Equipment
  • Etching Equipment

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scia Cube 300/450/750

scia Cube 300/450/750

Substrate bias mechanism! Introducing our microwave PECVD/etching equipment.

The "scia Cube 300/450/750" is a microwave PECVD/etching device compatible with substrates of 300×300mm, 450×450mm, and 750×750mm. The processes include microwave PECVD and reactive ion etching (RIE). Please feel free to consult us when you need assistance. 【Features】 ■ Compatible with substrates of 300×300mm, 450×450mm, and 750×750mm ■ Substrate bias mechanism ■ Substrate cooling and heating mechanism (-10 to 850℃) *For more details, please refer to the PDF materials or feel free to contact us.

  • Etching Equipment
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ICP-RIE『SI 500』

ICP-RIE『SI 500』

High-selectivity etching! Optimization of radical supply by adjusting the spacing between the ICP source and the substrate electrode.

The "SI 500" is an ICP-RIE that controls ion density through ICP power. It achieves a high etch rate with a high plasma density of 10^12 [ions/cm3] using the unique PTSA200ICP source. Additionally, it features low-damage etching through control of ion energy via bias power. 【Features】 ■ Control of ion density through ICP power ■ Control of ion energy through bias power ■ Optimization of radical supply by adjusting the distance between the ICP source and the substrate electrode ■ Low-damage etching ■ High selectivity etching *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment
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Plasma deposition and etching equipment "FLARION Series"

Plasma deposition and etching equipment "FLARION Series"

Plasma-assisted reactive film deposition is possible! It also supports options for integration.

The "FLARION series" is a plasma deposition and etching device. It enables plasma-assisted reactive deposition using the seamless ICP of the PLUM series. Additionally, it can be equipped with a substrate rotation mechanism, bias mechanism, and program-controlled axis motion mechanism, accommodating options for customization and integration. 【Features】 ■ Plasma-assisted reactive deposition possible with the seamless ICP of the PLUM series ■ Capable of being equipped with substrate rotation mechanism, bias mechanism, and program-controlled axis motion mechanism ■ Options available for customization and integration *For more details, please refer to the PDF materials or feel free to contact us.

  • Plasma surface treatment equipment
  • Etching Equipment

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WET process equipment LCD single-sheet etching equipment

WET process equipment LCD single-sheet etching equipment

The LCD substrate will undergo etching, shower cleaning, and drying processes through horizontal transport.

The WET process device, LCD single-sheet etching device, performs etching, shower cleaning, and drying processes for LCD substrates through horizontal transport. The WET device technology from Denshi Giken Co., Ltd., including cleaning spins, can meet the needs of a wide range of industries such as semiconductors, LCD, medical, and food industries, by cleaning wafers, glass substrates, printed circuit boards, metal substrates, and more. 【Features】 ○ Achieves uniform processes through dip, spray, and oscillation function etching ○ Parallel processing of etching/shower cleaning/drying processes ○ High efficiency of natural drop effect and replacement through substrate inclined washing function For more details, please contact us or download the catalog.

  • Circuit board processing machine
  • Etching Equipment
  • Etching Equipment

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Tabletop Plasma Etching Device 'TP-50B'

Tabletop Plasma Etching Device 'TP-50B'

Tabletop plasma etching device capable of localized processing with unique spot plasma technology.

The "TP-50B" is a 50W model that does not require installation permission applications under the Radio Law, and it is easy to operate, making it a tabletop plasma etching device that allows for casual plasma processing. With its unique spot plasma technology, it enables localized processing and can handle a wide range of plasma processing, from pre-treatment (exposing wiring) for semiconductor failure analysis samples to various plasma applications. Additionally, its compact size makes it suitable for research laboratories with limited space. 【Features】 ■ Compact tabletop size ■ Capable of localized plasma processing (Φ0.5mm and above) ■ Achieves low residue and high-speed processing (10μm/min) ■ Low output RF power supply (maximum output under 50W) ■ Allows for extensive processing by moving samples on a stage *For more details, please download the PDF or feel free to contact us.

  • Etching Equipment
  • Other semiconductor manufacturing equipment
  • Etching Equipment

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SUS etching device

SUS etching device

Design of the arrangement of transport components (rolls) developed independently by our company! Stable transport without corner bends or dents is possible.

The "SUS Etching Device" is a product that etches patterned SUS foil. Thanks to our uniquely developed design for the arrangement of transport components (rolls), stable transport is possible even for ultra-thin products without wrinkles, corner bends, or dents. An automatic management system for spray pressure, chemical concentration and temperature, and chemical specific gravity continuously creates an appropriate etching balance, maintaining consistent product quality. 【Features】 ■ Etches patterned SUS foil ■ Adopts an automatic management system ■ Stable transport of ultra-thin products *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment
  • Etching Equipment

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Research and development experimental equipment - Vertical etching device

Research and development experimental equipment - Vertical etching device

If it's about making etching machines, Kimura Etching.

We design and manufacture various wet processing equipment (etching, developing, stripping, cleaning, etc.) ranging from experimental devices for research and development purposes to production equipment. The main material for the equipment body is PVC, but we also manufacture using PP, PVDF, and SUS depending on the chemicals and temperatures used. All of our equipment is custom-made to meet the specific requirements of our customers. We also undertake on-site work such as equipment modifications and relocations.

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Etching device "MS-3030LWE"

Etching device "MS-3030LWE"

Formation of localized etching areas! High-precision shape creation through scanning.

The "MS-3030LWE" is a numerically controlled local wet etching device that can create arbitrary shapes by scanning a locally controlled liquid phase etching area with speed control. Since it is a non-contact chemical distortion-free processing method, it is insensitive to disturbances such as vibrations. The processing amount can be accurately controlled with nanometer-order precision based on the etchant's residence time and temperature, allowing for the creation of arbitrary shapes. [Features] - Non-contact processing - Chemical distortion-free processing - Nanometer-order processing precision - Creation of arbitrary shapes through 5-axis NC control *For more details, please refer to the catalog or feel free to contact us.

  • others
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CCP plasma etching device 'CCP-T60M/B2M'

CCP plasma etching device 'CCP-T60M/B2M'

High-precision and high-reliability oxide film microfabrication! Selectively generating radicals from process gases.

The "CCP-T60M/B2M" is a parallel plate etching device that achieves high precision and high reliability in oxide film microfabrication. It selectively generates radicals from process gases and applies 60MHz power to the upper electrode to obtain low electron temperature and high-density plasma. Additionally, it is equipped with a sequence program that constantly maintains appropriate etching process conditions. 【Features】 ■ Parallel plate etching device ■ Achieves high precision and high reliability in oxide film microfabrication ■ Selectively generates radicals from process gases ■ Applies 60MHz power to the upper electrode ■ Equipped with a sequence program *For more details, please refer to the PDF materials or feel free to contact us.

  • Etching Equipment
  • Etching Equipment

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Hybrid etching device

Hybrid etching device

Stable mass production, low cost! Etching equipment with low impact on the substrate.

At Tokyo Kako, we handle hybrid etching equipment that stably achieves a high etch factor in mass production. Since it does not use special additives, it is low-cost, and thanks to new technology, the etching shapes on both sides are equivalent. It is suitable for thin material transport and can handle 40μm transport. The impact on the substrate is low, which is advantageous for tenting. 【Features】 ■ Low cost as it does not use special additives ■ Stably achieves a high etch factor in mass production ■ New technology ensures equivalent etching shapes on both sides ■ Suitable for thin material transport, capable of 40μm transport ■ Low impact on the substrate, advantageous for tenting *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment
  • Etching Equipment

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Eminent Series Third Generation Etching Device "Eminent 2"

Eminent Series Third Generation Etching Device "Eminent 2"

High maintainability! An etching device with improved etching uniformity and pattern accuracy.

Tokyo Kako's "Eminent 2" is the successor to the etching device "Eminent," boasting a track record of delivering 180 units across five countries. The uniformity on both sides of the substrate has improved by over 35% due to enhancements in spray shape and flow rate. Additionally, by adopting a new type of wheel, we have established support for mass transport of core material substrates at 40μm. Maintenance has also been significantly improved. 【Features】 ■ Improved etching uniformity ■ Enhanced transportability for thin materials ■ Significant improvement in maintenance ■ Improved pattern accuracy *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment
  • Etching Equipment

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Wire and tube etching device

Wire and tube etching device

Processing that is stronger than UV treatment but weaker than blasting or polishing is possible. It is suitable for processing elongated workpieces, compact, and has low running costs.

- Can process workpieces with weak mechanical strength - Non-contact treatment that does not damage the workpiece - Does not use liquids - Can process not only metals but also resins - Only Ar gas and water are required for the process - Does not produce dust or waste - Can be installed in clean rooms (excluding vacuum pumps)

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Ion Beam Milling and Etching Equipment - Hakuto/Ns

Ion Beam Milling and Etching Equipment - Hakuto/Ns

We propose the optimal dry etching equipment for processing difficult-to-etch materials such as Au, Pt, and magnetic materials!

Ion beam milling equipment is used as a fine processing device in dry processes, with a wide range of applications from research and development to production. Due to its physical etching process that does not involve chemical reactions, materials such as Au, Pt, magnetic materials, and metal multilayers can be easily processed. 【Features】 (1) Capable of fine processing difficult-to-etch materials (2) Metal multilayers can be processed in a one-step process (3) The self-rotating stage allows for uniform simultaneous processing of multiple wafers (4) The substrate cooling stage (water-cooled or water/gas-cooled) suppresses substrate temperature rise, preventing resist burning (5) The variable stage angle makes taper processing easy (anisotropic etching)

  • Etching Equipment
  • Etching Equipment

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